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FLY-801 TO Laser Diode Wire bonder

FeaturesParameters

Features

- Thermosonic high speed bonding, fast conversion

- Vision system: Programmable look ahead PR

- Multiple die and level bonding capability

- Rotating platform

- Bonding on crossed planes at any angle

 

Wire type

Au


Applied Range

Optical communications


Item

Parameter

Bonding   Technology

Thermosonic bonding

Optics

Single path or double paths (optional)

Bonding Accuracy

±3.0μm

Bonding area

56 x 70mm

Cycle time

Parallel planes: 60ms/wire

Crossed planes: 80ms/wire

Wire diameter

17μm-50μm


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